Product Information

The prepFAST S ultraclean sample preparation and introduction system minimizes contamination from the environment and sample handling, enabling semiconductor manufacturers and laboratories to easily analyze these critical samples. The prepFAST S features inline, automated calibration and dilution technology that automates sample and standard preparation.

Nitric Acid is widely utilized in the semiconductor industry as a cleaning agent. The reduction of potential contamination of silicon wafers during the cleaning process is crucial as trace metal, particulate and organic contaminants can alter the functionality of the semiconductors. At the ppt level, environmental contaminants are difficult to control and can easily contaminate a HNO₃ sample if not properly handled.

Sulfuric acid (H₂SO₄) is used in the semiconductor industry as a means to clean and etch silicon wafers. The reduction of potential contamination of silicon wafers during the etching process is crucial, as trace metal, particulate, and organic contaminants can alter the functionality of semiconductors. At the sub-ppt level, environmental contaminants are difficult to control and can easily contaminate a H₂SO₄ sample if not properly handled.

Buffered oxide etchants (BOEs) are blends of hydrofluoric acid, ammonium fluoride, surfactants, and ultrapure water utilized in the semiconductor industry to etch thin films of silicon wafers. The reduction of potential contamination of silicon wafers during the etching process is crucial, as trace metal, particulate, and organic contaminants can alter the functionality of semiconductors. At the sub-ppt level, environmental contaminants are difficult to control and can easily contaminate a BOE sample if not properly handled.

Tetramethylammonium Hydroxide (TMAH) is a basic solvent widely utilized in the semiconductor industry for photoresist development and lithography applications. The reduction of potential contamination of silicon wafers during the etching process is crucial as trace metal, particulate and organic contaminants can alter the functionality of the semiconductors. At the ppt level, environmental contaminants are difficult to control and can easily contaminate a TMAH sample if not properly handled.

Ultrapure water (UPW) is widely utilized in the semiconductor as a cleaning agent. The reduction of potential contamination of silicon wafers during the cleaning process is crucial as trace metal, particulate and organic contaminants can alter the functionality of the semiconductors. At the ppt level, environmental contaminants are difficult to control and can easily contaminate an UPW sample if not properly handled.